Integrated Device for Power New Energy Smart Substations Based on x86/RK3568

I. Project Overview

Smart substations have always been a hot topic in the power industry. Addressing the construction requirements of smart substations, this application aims to solve problems such as low automation, poor economics, inconvenient operation and maintenance, and difficulty in achieving networked management in traditional station power supplies. By adopting the latest power electronics and communication measurement and control technologies, a new generation of highly reliable, cost-effective integrated power supply system has been developed.

The integrated master monitoring unit, as the centralized monitoring and management unit of the smart integrated power supply system, can simultaneously monitor various station power supply equipment. Downstream, it communicates with each sub-unit monitoring device, collects sub-unit operating conditions and information data, achieving distributed measurement and control with centralized management. Upstream, it connects to station control layer equipment via an Ethernet interface using the IEC61850 protocol, enabling remote monitoring and digital management of the integrated power supply system. This device features rich serial port and Ethernet communication resources. It supports flexible time synchronization methods, including IRIGB (DC) code and PPS (pulse per second) time synchronization. With a large 320×240 dot-matrix LCD display and a full Chinese human-machine interface, operation is convenient.

It is evident that the master monitoring unit of the integrated power supply has high requirements. This project specifically addresses the customer's unique needs by upgrading the master monitoring unit of the integrated power supply, achieving comprehensive and significant improvements, helping the customer complete product upgrades and better promote them in the market.

II. System Requirements

◆ Fanless design for the entire machine, low power consumption;

◆ 10.4-inch touchscreen, Linux operating system;

◆ Ethernet interface;

◆ Supports multiple serial ports;

◆ Supports IRIG-B time synchronization and PPS (pulse per second);

◆ High and low temperature resistance;

◆ Power industry Level 3 test standard.

III. Solution

Application Architecture:

◆ The motherboard uses an RDC chip, adopting an ODM customization approach to meet customer-specific functions;

◆ 10.4-inch industrial-grade LCD touchscreen;

◆ Customized casing and silk-screen printing. System Features:

◆ Excellent performance in high and low temperatures;

◆ Using an RDC chip offers unique advantages compared to traditional ARM chips, such as:

1. Longer supply longevity,

2. X86 architecture makes development more convenient,

3. More reliable in high and low temperatures compared to ARM, etc.

◆ Fanless, low-power consumption design;

◆ The entire machine meets the power industry Level 3 test standard, ensuring reliable performance.

IV. Conclusion

This industry application is highly competitive among similar products. All aspects of its test performance are very satisfactory. The use of an RDC chip significantly enhances the product's high and low temperature resistance and extends its supply longevity. This application features low power consumption, fanless design, and good expandability, making it widely applicable in various smart substations. The high reliability and high performance characteristics of Sienovo's ODM products make them leaders among integrated monitoring devices for smart substations.