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Application of ZYNQ MPSoC + QNX Real-time System + CPCI Board in Rail Transit Modular Systems

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Application of ZYNQ MPSoC + QNX Real-time System + CPCI Board in Rail Transit Modular Systems

Block Diagram

 

Technical Specifications

— Dual Main Control Chips: XC7Z020-CLG484 and XC7VX690T-2FFG1761I;

— Memory:

-XC7VX690T with 8x 16-bit 1600 DDR3 SDRAM (up to 4GB supported), maximum bandwidth up to 25.6GB/s;

-XC7Z020 with 2x 16-bit 1600 DDR3 SDRAM (up to 4GB supported), maximum bandwidth up to 6.4GB/s;

-Supports SPI Flash for program loading;

-Features eMMC interface (can also be used as I/O expansion for XC7Z020); Features SD card interface;

— Communication and Networking

-Supports UART communication;

-Supports Ethernet communication;

-Supports USB2.0 OTG slave mode;

— Configuration: JTAG program download via Micro USB interface

— Expansion Connectors: 2x FMC-HPC interfaces

— 160 single-ended or 80 differential (34 pairs LA, 24 pairs HA, and 22 pairs HB) user-defined pins;

— High-speed pins: Supports 8 lanes;

— VADJ supports 1.2~3.3V adjustable;

— Supports IIC;

— Supports JTAG;

— Optical Fiber Interface - SFP+

— Control & I/O

— Multiple switches and buttons;

— Multiple LED indicators;

— Cooling:

— Supports 12V fan cooling;

— Supports air cooling (using a cold plate heat sink);

— Backplane Power Supply;

— Supports 12V and 5V external power supply;

— Operating Temperature Range: Commercial grade 0~70℃; Industrial grade -40℃~70℃.

— Physical Dimensions: 233.35mm x 160.00mm x 25.40mm

I. Hardware Architecture Design Highlights

  1. ZYNQ MPSoC Heterogeneous Computing Advantages

    • Leverages its quad-core Cortex-A53 processor to run the QNX real-time system, handling complex tasks such as train control and communication protocol stacks; the dual-core Cortex-R5 processor achieves hard real-time responses, such as emergency braking signal processing.
    • The FPGA logic units (PL side) can be customized to implement rail transit-specific interfaces (e.g., MVB, CAN bus) or accelerate sensor data pre-processing.
  2. CPCI Board Modular Features

    • Supports hot-swappable design, facilitating on-board equipment maintenance and functional expansion, for example, rapidly deploying redundant control modules via the CPCI backplane.
    • Integrates high-speed PCIe interfaces (Gen2/3) to achieve low-latency data transfer (≤1μs) between the ZYNQ MPSoC and the CPCI board, meeting train network communication requirements.
  3. Storage and Boot Redundancy Design

    • Utilizes a QSPI + eMMC dual-storage media configuration, where QSPI stores the bootloader for millisecond-level cold boot, and eMMC stores operation logs and configuration files, supporting rapid fault recovery.
    • Through a separated design of PS-side DDR4 memory (5GB) + PL-side DDR4 memory (4GB), bandwidth requirements for system operation and hardware acceleration are ensured respectively.

II. Software System Implementation Plan

  1. QNX Real-time System Optimization

    • Leverages QNX microkernel architecture (memory footprint <2MB) to achieve deterministic task scheduling, ensuring critical task response times ≤10ms for signal light control, door status monitoring, and other functions.
    • Supports IPC message passing mechanism to achieve data synchronization and abnormal status monitoring between PS-side A53/R5 cores.
  2. Driver and Middleware Development

    • Develops CPCI board drivers based on the V4L2 framework, supporting multi-channel video acquisition (e.g., carriage surveillance) and hardware video encoding/decoding (H.265 compression ratio ≥50:1).
    • Integrates SDF cryptographic interface library, utilizing PL-side national cryptographic algorithm acceleration chips to achieve on-board communication data encryption (SM4 throughput ≥1Gbps).

III. Typical Application Scenarios

  1. On-board Control System

    • Runs Automatic Train Protection (ATP) algorithms, acquiring track circuit signals via CPCI expansion I/O modules, with FPGA implementing 32-channel ADC data parallel processing.
    • The QNX system manages dual redundant networks (Ethernet + MVB), achieving fault-over time <500ms.
  2. Trackside Monitoring Equipment

    • Builds distributed acquisition nodes based on CPCI chassis, with ZYNQ MPSoC processing LiDAR point clouds (1 million points/second) to detect track geometric deformation with an accuracy of ±0.1mm.

IV. Reliability Assurance Measures

  1. Operating temperature range of -40℃~85℃, compliant with EN50155 standard for railway electronic equipment.
  2. Supports ECC memory error correction and watchdog circuitry, achieving 72 hours of fault-free operation.
  3. Boot process configured with a three-level rollback mechanism, enabling system recovery within 15 seconds in case of anomalies.