X86/ARM-based SLAM+AI Robot Controller [Semiconductor Solutions] Smart Logistics Upgrade for Semiconductor Packaging and Testing Process Segments

A globally renowned semiconductor enterprise is undergoing a smart logistics upgrade for its packaging and testing process segments. This project covers two cleanroom scenarios, involving over 70 pieces of various semiconductor equipment, with a total route length exceeding 5 kilometers. More than 40 AMRs are deployed on-site, operating 24 hours a day without interruption, which severely tests the durability of both the AMR scheduling system and the AMR vehicles themselves.

Solution Highlights:

40+ cleanroom-certified composite robots specifically for packaging and testing

Line-side buffer stations

Warehouse and Logistics Management System (MWMS)

Unified Resource Dispatching System (RDS)

Challenges and Solutions:

Challenge 1: Difficult and lengthy deployment of 2D vision solutions

Solutions:

1. No markers required for production or installation
2. Significantly reduced deployment cycle for multiple devices
3. No additional light source needed, more reliable recognition
4. SRC controller enables unified control of chassis, robotic arm, and vision

Challenge 2: Safety issues during gripping

Solutions:

1. Patented new gripper design
2. Integration of all arm-mounted auxiliary devices with the SRC controller
3. 360° omnidirectional safety sensing capability.

Challenge 3: Mismatched cycle times between processes and low efficiency

Solutions:

1. Advantage of underlying algorithms, considering globally optimal task assignment from the ground up to prevent AMRs from idle running.
2. Powerful on-board caching capability and modular storage slot design
3. Diverse AMR transport modes
4. Customized line-side buffer "micro-warehouses" combined with a self-developed MWMS system to enable intelligent order planning and intelligent order volume early warning based on customer production schedules.
5. Powerful software simulation capabilities, with simulation results directly applied to real-world operations (WYSIWYG simulation).

Hardware Specifications

Hardware Platform

Processor

RK3588, 4 x A76, 4 x A55, 2.0GHz

Memory

8GB LPDDR4

Storage

On-board 64GB eMMC5.1

Interface Type

Serial Port

2x RS232/RS485, DB9 Connector for external (COM1/COM2) Serial port baud rate: 9600~115200bits/s

USB

USB1: 1x USB3.0/USB2.0 Host, Type-A Stack ports; USB2: 1x USB3.0/USB2.0 Host, Type-A Stack ports

Ethernet Port

1x GbE port by RJ45 with RTL8211F Controller

2x GbE port by RJ45 with Intel I210AT

M.2

1x M.2 M-Key 2242/2280 (PCIe3.0/SATAIII)

1x M.2 B-Key 3042/3052 (USB3.0/2.0), supports 4G/5G

GPIO

8x GPIO, 2*5Pin, PH=3.5mm, supports APP customization

Mini PCIe

1x Internal Mini PCIe (USB2.0), 52P, for WIFI module connection

SIM

1x SIM Card SLOT, NANO-SIM (4G/5G*1)

Power Interface

DC9~36V input, with reverse polarity protection

Audio

1x Audio Jack, Φ3.5mm, Green (Line out)

Display

HDMI IN/OUT

1x HDMI OUT2.1, supports 4K display; 1x HDMI IN, supports 4K@60fps video input

LVDS (Internal)

1x LVDS, supports 1920 x 1080@60Hz resolution

eDP (Internal)

1x eDP interface, DF13, supports 8K@60fps

LED

1x Power indicator, typically green, 3mm

1x Hard drive indicator (M.2), typically yellow, 3mm

Features

Watchdog Timer

Software programmable 1–255 level

Physical Characteristics

Dimensions

206130mm45mm

Structural Material

Black anodized aluminum heat sink / Outer frame: Iron casing (SECC) / Black mounting ears

Mounting Method

Wall Mount Ears

Operating Temperature

-20℃~60℃

Storage Temperature

-30℃~70℃

Relative Humidity

10%~90%