【PXIe Bus Board】K7 FPGA Data Acquisition Card Based on Standard 3U PXIe Bus Architecture

A high-performance data pre-processing FMC carrier board based on the PXI Express bus architecture. The board features one FMC (HPC) interface and one x8 PCIe host interface. It utilizes Xilinx's high-performance Kintex-7 series FPGA as the real-time processor to achieve data acquisition and processing from the FMC interface, as well as conversion for the PCI Express bus interface. It includes one independent 64-bit DDR3 SDRAM large-capacity cache on board. By integrating various FMC daughter cards, this board can quickly establish a verification platform based on the PXI Express instrument bus. This board is a standard 3U PXI Express size, suitable for standard Eurocard PXIe chassis, and can be widely applied in scenarios such as radar and IF signal acquisition, and video image acquisition.

Standard 3U PXIe Specifications

• 1 FMC (HPC) interface, compliant with VITA57 specification
• Onboard 1 XC7K325T FPGA processor
• Supports x8 PCIe host interface, system bandwidth 4 GByte/s
• Onboard high-precision clock generator
• Supports RS232/RS422/RS485 interfaces

Technical Specifications

• Onboard FPGA Real-time Processor: XC7K325T-2FFG900I;
• Host Interface Specifications:
  1. Compliant with PXIe standard, supports PCI Express 2.0 specification;
  2. Supports PCIe Gen2 x8@5Gbps/lane;
  3. PCIe bidirectional DMA transfer bandwidth: 3.2 GByte/s;
• FMC Interface Specifications:
  1. Standard FMC (HPC) interface, compliant with VITA57.1 specification;
  2. Supports x8 GTX@10Gbps/lane high-speed serial bus;
  3. Supports 80 pairs of LVDS signals;
  4. Supports IIC bus interface;
  5. +3.3V/+12V/+VADJ power supply, power output ≥15W;
  6. Independent VIO_B_M2C power supply (can be provided by daughter card)
• Dynamic Storage Performance:
  1. Storage bandwidth: 64-bit, DDR3 SDRAM, 500MHz operating clock;
  2. Storage capacity: Maximum support for 4 GByte DDR3 SDRAM;
• Other Interface Performance:
  1. 1 high-precision clock unit, supports 1 external clock input, 2 synchronous clock outputs;
  2. 2 RS485 interfaces, 4 LVTTL inputs, 4 LVTTL outputs;
  3. Onboard 1 FRAM memory, 1 BPI Flash;
• Physical and Electrical Characteristics
  1. Board dimensions: 100 x 160mm
  2. Board power supply: 1.5A max@+12V (±5%)
  3. Cooling method: Metal conduction cooling
• Environmental Characteristics
  1. Operating temperature: -40°C ~ +85°C;
  2. Storage temperature: -55°C ~ +125°C;
  3. Operating humidity: 5%~95%, non-condensing

Application Areas

• Software Defined Radio (SDR);
• Radar and Baseband Signal Processing;
• High-speed Image and Graphics Processing;

Functional Block Diagram