4-Channel FMC Interface Baseband Signal Processing Platform Based on Virtex UltraScale+ VU13P FPGA

• Virtex UltraScale+ Series FPGA Processor: XCVU13P-2FHGB2104I
• Number of Dynamic Memory Modules: 2 groups of DDR4 SDRAM
• Dynamic Memory Capacity: 4 GBytes per group, 8 Gbits per chip
• Dynamic Memory Bandwidth: Operating clock 1000MHz, data rate 2000Mbps
• Onboard 6-channel QSFP+ optical interfaces
• Onboard 4 FMC+ high-speed expansion interfaces

This high-performance 4-channel FMC interface baseband signal processing platform, based on the Virtex UltraScale+ series FPGA, utilizes one Xilinx Virtex UltraScale+ series FPGA, the XCVU13P, as the real-time signal processing unit. The board features four FMC daughter card interfaces (two of which are FMC+ interfaces). Nodes are interconnected via high-speed serial buses. This FPGA supports high-speed serial buses up to 32 Gbps, suitable for 100G Ethernet, JESD204B/JESD204C, and other high-speed interfaces. The board adopts an embedded non-standard structure, featuring excellent anti-vibration design, thermal dissipation performance, and unique environmental protection design. It is suitable for ultra-wideband baseband signal processing, multi-channel AD/DA synchronous acquisition and processing, and similar applications.

Functional Block Diagram

Technical Specifications

• FPGA + Multi-core DSP collaborative processing architecture;
• 1 multi-core DSP processing node, 1 Kintex-7 FPGA processing node;
• Processing Performance:
  1. DSP Fixed-point operations: 40 GMAC/Core * 8 = 320 GMAC;
  2. DSP Floating-point operations: 20 GFLOPs/Core * 8 = 160 GFLOPs;
• Storage Performance:
  1. DSP Processing Node: 4 GByte DDR3-1333 SDRAM;
  2. DSP Processing Node: 4 GByte Nand Flash;
  3. FPGA Processing Node: 1 group of 2 GByte DDR3-1600 SDRAM;
• Interconnect Performance:
  1. DSP to FPGA: SRIO x4 @ 5 Gbps/lane;
  2. FPGA to FMC Interface: 2 channels GTH x4 @ 10 Gbps/lane;
• Physical and Electrical Characteristics
  1. Board Dimensions: 171 x 204 mm
  2. Board Power Supply: 3A max @ +12V (±5%)
  3. Cooling Method: Metal conduction cooling
• Environmental Characteristics
  1. Operating Temperature: -40°C to +85°C, Storage Temperature: -55°C to +125°C;
  2. Operating Humidity: 5% to 95%, non-condensing

Application Areas

• Software Defined Radio (SDR);
• Radar and Baseband Signal Processing;
• High-speed Image and Graphics Processing;