[DSP+FPGA] High-Performance Real-time Signal Processing Platform Based on Virtex-7 FPGA + C6678 DSP

• DSP + FPGA Co-processing Architecture
• Onboard one TMS320C6678 multi-core DSP processing node
• Onboard one XC7VX690T FPGA processing node
• Onboard one FMC interface
• Onboard four SFP+ fiber optic interfaces
• High-speed RapidIO interconnect between FPGA and DSP

This high-performance real-time signal processing platform based on Virtex-7 FPGA utilizes one TI KeyStone series multi-core DSP TMS320C6678 as the main processing unit and one Xilinx Virtex-7 series FPGA XC7VX690T as the co-processing unit. It features two FMC daughter card interfaces, with processing nodes interconnected via high-speed serial buses. The board supports four SFP+ 10 Gigabit fiber optic interfaces and two RJ45 Gigabit Ethernet ports, making it suitable for high-speed real-time signal processing.

Functional Block Diagram

Technical Specifications

• FPGA + Multi-core DSP Co-processing Architecture;
• One multi-core DSP processing node, one Kintex-7 FPGA processing node;
• Processing Performance:
  1. DSP Fixed-point operations: 40 GMAC/Core * 8 = 320 GMAC;
  2. DSP Floating-point operations: 20 GFLOPS/Core * 8 = 160 GFLOPS;
• Storage Performance:
  1. DSP Processing Node: 4 GByte DDR3-1333 SDRAM;
  2. DSP Processing Node: 4 GByte Nand Flash;
  3. FPGA Processing Node: One set of 2 GByte DDR3-1600 SDRAM;
• Interconnect Performance:
  1. DSP to FPGA: SRIO x4 @ 5 Gbps/lane;
  2. FPGA to FMC Interface: 2 channels GTH x4 @ 10 Gbps/lane;
• Physical and Electrical Characteristics
  1. Board Dimensions: 171 x 204mm
  2. Board Power Supply: 3A max @ +12V (±5%)
  3. Cooling Method: Metal conduction cooling
• Environmental Characteristics
  1. Operating Temperature: -40°C to +85°C, Storage Temperature: -55°C to +125°C;
  2. Operating Humidity: 5% to 95%, non-condensing

Application Areas

• Software-Defined Radio (SDR);
• Radar and Baseband Signal Processing;
• High-speed Image and Graphics Processing;