[DSP+FPGA] Universal Signal Processing Platform Based on DSP+FPGA XC7K325T and TMS320C6678

• DSP + FPGA Collaborative Processing Architecture
• Onboard 1 TMS320C6678 Multi-core DSP Processing Node
• Onboard 1 XC7K325T FPGA Processing Node
• Onboard 1 FMC Interface
• Onboard 4 SFP+ Optical Fiber Interfaces
• High-speed RapidIO Interconnect between FPGA and DSP

A general-purpose high-performance real-time signal processing platform based on an FPGA and DSP collaborative processing architecture. This platform uses one TI KeyStone series multi-core floating-point/fixed-point DSP TMS320C6678 as the main processing unit, and one Xilinx Kintex-7 series FPGA XC7K325T as the co-processing unit. It features one FMC daughter card interface and four SFP+ 10 Gigabit optical fiber interfaces. Processing nodes are interconnected via high-speed serial buses. By pairing with different FMC daughter cards, this system can be widely applied in scenarios such as software-defined radio, radar signal processing, baseband signal processing, wireless simulation platforms, and high-speed graphics and image processing.

Functional Block Diagram

Technical Specifications

• FPGA + Multi-core DSP Collaborative Processing Architecture;
• 1 Multi-core DSP Processing Node, 1 Kintex-7 FPGA Processing Node;
• Processing Performance:
  1. DSP Fixed-point Operations: 40 GMAC/Core * 8 = 320 GMAC;
  2. DSP Floating-point Operations: 20 GFLOPs/Core * 8 = 160 GFLOPs;
• Storage Performance:
  1. DSP Processing Node: 4 GByte DDR3-1333 SDRAM;
  2. DSP Processing Node: 4 GByte NAND Flash;
  3. FPGA Processing Node: 1 set of 2 GByte DDR3-1600 SDRAM;
• Interconnect Performance:
  1. DSP to FPGA: SRIO x4 @ 5 Gbps/lane;
  2. FPGA to FMC Interface: 2 GTH x4 @ 10 Gbps/lane;
• Physical and Electrical Characteristics
  1. Board Dimensions: 171 x 204 mm
  2. Board Power Supply: 3A max @ +12V (±5%)
  3. Cooling Method: Conduction Cooling
• Environmental Characteristics
  1. Operating Temperature: -40°C ~ +85°C, Storage Temperature: -55°C ~ +125°C;
  2. Operating Humidity: 5% ~ 95%, non-condensing

Software Support

• Optional Integrated Board Support Package (BSP);
  1. DSP Low-level Interface Drivers;
  2. FPGA Low-level Interface Drivers;
  3. Board-level Interconnect Interface Drivers;
  4. SYS/BIOS-based Multi-core Parallel Processing Low-level Drivers;
• Customized algorithms and system integration can be provided based on customer requirements:

Application Areas

• Software-Defined Radio (SDR);
• Radar and Baseband Signal Processing;
• High-speed Image and Graphics Processing;