4-Channel 250 MSPS IF Signal Acquisition, Processing, and Storage System Based on 3U PXIe Bus Architecture

• Standard 3U PXIe Specification
• 1 FMC AD Daughter Card, supporting 4-channel 250 MSPS 16-bit AD acquisition
• Onboard 1 XC7K325T FPGA Processor
• Supports x8 PCIe Host Interface, System Bandwidth 4 GByte/s
• Supports Inter-board Synchronization
• Supports Multi-system Synchronization

An Intermediate Frequency (IF) signal acquisition, processing, and storage system based on the PXI Express bus architecture. The system consists of one PXIe-compliant FMC carrier board and one FMC AD daughter card. The system features an x8 PCIe host interface, and the system board utilizes a high-performance Xilinx Kintex-7 series FPGA as the real-time processor, enabling the acquisition and processing of FMC interface data, as well as conversion to the PCI Express bus interface. It includes one independent 64-bit DDR3 SDRAM large-capacity cache onboard. This board is a standard 3U PXI Express size, suitable for standard Eurocard PXIe chassis, and can be widely applied in scenarios such as radar and IF signal acquisition, and video image acquisition.

Technical Specifications

• Onboard FPGA Real-time Processor: XC7K325T-2FFG900I;
• Host Interface Specifications:
  1. Complies with PXIe standard, supports PCI Express 2.0 specification;
  2. Supports PCIe Gen2 x8@5Gbps/lane;
  3. PCIe Bidirectional DMA Transfer Bandwidth: 3.2 GByte/s;
• FMC AD Daughter Card Performance Specifications:
  1. 4-channel 250 MSPS 16-bit AD acquisition;
  2. Supports single-ended AC-coupled input;
  3. Input Voltage Range: 1Vpp~2Vpp;
  4. Analog Input Bandwidth: 500MHz;
  5. Controllable Gain Range: 6dB, 0.5dB step;
  6. ENOB@170MHz: 11.85 bits
• Dynamic Storage Performance:
  1. Storage Bandwidth: 64-bit, DDR3 SDRAM, 500MHz operating clock;
  2. Storage Capacity: Max support 4 GByte DDR3 SDRAM;
• Other Interface Performance:
  1. 1 high-precision clock unit, supporting 1 external clock input, 2 synchronized clock outputs;
  2. 2 RS485 interfaces, 4 LVTTL inputs, 4 LVTTL outputs;
  3. Onboard 1 FRAM memory, 1 BPI Flash;
• Physical and Electrical Characteristics
  1. Board Dimensions: 100 x 160mm
  2. Board Power Supply: 1.5A max@+12V (±5%)
  3. Cooling Method: Metal conduction cooling
• Environmental Characteristics
  1. Operating Temperature: -40°~﹢85°C;
  2. Storage Temperature: -55°~﹢125°C;
  3. Operating Humidity: 5%~95%, non-condensing

Functional Block Diagram

Application Areas

• Software Defined Radio (SDR);
• Radar and Baseband Signal Processing;
• High-Speed Image and Graphics Processing;