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FPGA+DSP Architecture-based Intermediate Frequency Signal Acquisition, Processing, and Remote Optical Fiber Transmission System for Radar Applications

#fpga开发#网络

This is a high-performance radar signal real-time acquisition and processing platform based on optical fiber transmission. The platform integrates an I/O unit, a signal processing unit, and a remote transmission unit, enabling real-time acquisition, real-time processing, high-speed transmission, and high-speed storage of radar signals. The system platform consists of one signal processing platform card and one 4-channel optical fiber acquisition card, as shown in Figure 1. The signal processing platform is equipped with one 8-channel, 250 MSPS sampling rate, 16-bit AD acquisition FMC daughter card. The system's operating principle is as follows: 8 channels of analog AD signals (from the antenna array) enter four high-speed ADCs via SSMC interfaces. The FPGA drives these four high-speed ADCs and completes real-time synchronous data acquisition of analog intermediate frequency signals. The FPGA features large-capacity on-board caching and performs complex algorithm processing, precisely measuring the phase of multiple antenna arrays entirely from a time-domain perspective. The signal processing board also features one TI multi-core DSP processor C6678 for fast spectrum analysis. Real-time data sharing between the FPGA and DSP is achieved via a high-speed interface, enabling powerful signal processing capabilities from both time-domain and frequency-domain perspectives. The platform uses single-mode or multi-mode optical fiber for remote transmission, and high-speed serial communication ensures that acquired data is updated in real-time on the server. This system achieves real-time acquisition, real-time processing, remote transmission, and high-speed storage of radar signals. It widely uses high-speed serial buses such as SRIO, PCIe, and Ethernet for data transmission, offering advantages such as high performance, high availability, and high reliability.

  • Supports 8 channels of 250 MSPS sampling rate, 16-bit analog signal input
  • Supports 4 SFP+ optical fiber channels, with up to 10Gbps/lane
  • On-board 1 XC7K325T FPGA processor
  • On-board 1 TMS320C6678 multi-core processor
  • Supports 2 Gigabit Ethernet ports
  • Supports multi-system cascading and synchronous acquisition

Functional Block Diagram

Technical Specifications

  • System Composition:
    1. One 8-channel, 250 MSPS sampling rate, 16-bit resolution AD acquisition FMC daughter card (Model: FMC128);
    2. One FPGA + DSP signal processing board (Model: TES600);
    3. One 4-channel optical fiber acquisition card (Model: PCIE730);
  • System Interconnection:
    1. AD daughter card and signal processing board: FMC high-speed connector LVDS interconnection;
    2. Signal processing board and optical fiber acquisition card: Interconnected via single-mode or multi-mode optical fiber;
    3. Optical fiber acquisition card and server: Interconnected via PCIe bus;
  • Acquisition Performance:
    1. Maximum support for 8-channel, 250 MSPS sampling rate, 16-bit resolution real-time acquisition;
    2. Input voltage range: 1Vpp (4dBm) ~ 2Vpp (10dBm), programmable input voltage range;
    3. Analog input bandwidth: 500MHz (typical);
    4. SFDR@170MHz: 87dBc;
    5. SNR@170MHz: 73.2dBFS;
    6. ENOB@170MHz: 11.85bits;
    7. 8-channel AD synchronous acquisition;
  • Processing Performance (Signal Processing Board):
    1. DSP fixed-point operations: 40 GMAC/Core * 8 = 320 GMAC;
    2. DSP floating-point operations: 20 GFLOPs/Core * 8 = 160 GFLOPs;
  • Transmission Performance:
    1. Supports Serial RapidIO, Aurora, and other transmission protocols;
    2. Serial RapidIO supports 6.25Gbps line rate, Aurora supports 10Gbps line rate;
    3. Supports single-mode or multi-mode optical fiber, maximum transmission distance 80KM;
  • Storage Performance:
    1. Storage bandwidth: 64-bit, DDR3 SDRAM, 500MHz operating clock;
    2. Storage capacity: Maximum support for 4GByte DDR3 SDRAM;
  • Other Interface Performance:
    1. One high-precision clock unit, supporting 1 external clock input, 2 synchronous clock outputs;
    2. 2 RS485 interfaces, 4 LVTTL inputs, 4 LVTTL outputs;
    3. On-board 1 FRAM memory, 1 BPI Flash;
  • Physical and Electrical Characteristics
    1. Board dimensions: 100 x 160mm
    2. Board power supply: 1.5A max@+12V (±5%)
    3. Cooling method: Metal conduction cooling
  • Environmental Characteristics
    1. Operating temperature: -40°C ~ +85°C;
    2. Storage temperature: -55°C ~ +125°C;
    3. Operating humidity: 5%~95%, non-condensing

Software Support

  • Optional integrated Board Support Package (BSP);
    1. FPGA low-level interface drivers;
    2. DSP low-level interface drivers;
    3. Board-level interconnection interface drivers;
  • Customizable algorithms and system integration can be provided according to customer requirements:

Application Areas

  • Software-defined radio;
  • Radar and baseband signal processing;