A fully localized ARM core board based on Shanghai Fudan Microelectronics FMQL45T900. This core board integrates the minimal system of Fudan Micro's FMQL45T900 (compatible with XILINX's XC7Z045-2FFG900I) onto an 87*117mm core board. It can serve as a core module for functional expansion, enabling rapid construction of a signal processing platform and facilitating user product development. The core board features DDR3 SDRAM, eMMC, SPI Flash, Ethernet PHY chips, and more. I/O expansion for the PL (Programmable Logic) side is achieved through two board-to-board FMC connectors. The FMQL45T900 is an all-programmable SoC developed by Fudan Microelectronics. It integrates a Processing System (PS) based on a feature-rich quad-core processor and Programmable Logic (PL) on a single chip, utilizing an advanced 28nm process. Coupled with corresponding development software, it enables an integrated hardware and software platform, facilitating user development, shortening development cycles, and reducing production costs.

Equipped with Fudan Micro FMQL100TAI900 core board
PS side: 1GByte DDR3 SDRAM, 8GByte eMMC, 256Mbit QSPI Flash
PS side: 2x RJ45 Ethernet
PL side: 64-bit 2GByte DDR3 SDRAM, 4x SFP+ optical
PL side: PCIe 2.0 x4
PL side: 1x FMC (HPC) interface (supports 8x GTX, 80x LVDS)

Functional Block Diagram

Technical Specifications

Onboard FPGA real-time processor
FPGA Model: Fudan Micro FMQL45T900;
Dynamic Memory Specifications:
1. Number of memory chips: 2 DDR3 SDRAM devices;
2. Chip Model: Unigroup Guoxin SCB13H4G160AF;
3. Memory bandwidth: 32-bit data bus, operating clock frequency no less than 500MHz;
4. Memory capacity: 1GByte;
Non-volatile Storage:
1. QSPI FLASH: Fudan Micro JFM25Q256, capacity 256Mbit;
2. Supports 1x HDMI high-definition digital output display interface;
3. eMMC: Longsys FEMDRW008G, capacity 8GByte;
Physical and Electrical Characteristics
1. Board dimensions: 87 x 117mm
2. Board power supply: max 3A@+12V (±5%)
3. Cooling method: Air cooling
Environmental Characteristics
1. Operating temperature: -40°C ~ +85°C;
2. Storage temperature: -55°C ~ +125°C;
3. Operating humidity: 5%~95%, non-condensing

Software Support

Optional integrated Board Support Package (BSP);
Customizable algorithms and system integration can be provided based on customer requirements.

Application Areas

UAV flight control systems;
Robot controllers;
Smart home, smart printing;
Consumer medical devices.