Product Overview

This high-performance data pre-processing FMC carrier board is based on a PCI Express bus architecture. The board features one FMC (HPC) interface and one x8 PCIe host interface. It utilizes a Xilinx high-performance Kintex-7 series FPGA as the real-time processor to achieve data acquisition and processing from the FMC interface, as well as conversion for the PCI Express bus interface. An independent 64-bit DDR3 SDRAM large-capacity cache is onboard. By integrating different FMC daughter cards, this board can quickly establish a PCI Express bus-based verification platform. As a standard full-height, half-length PCIe card, it is suitable for use in PCIe industrial PCs and applicable to scenarios such as radar and IF signal acquisition, and video image acquisition and transmission.

Standard PCIe full-height, half-length card
1 FMC (HPC) interface, compliant with VITA57 specification
Onboard 1 XC7K325T FPGA processor
Supports x8 PCIe host interface, system bandwidth 4 GByte/s
Onboard high-precision clock generator
Supports RS232/RS422/RS485 interfaces

Functional Block Diagram

Technical Specifications

Onboard FPGA Real-time Processor: XC7K325T-2FFG900I;
Host Interface Specifications:
1. Compliant with PCIe standard, supports PCI Express 2.0 specification;
2. Supports PCIe Gen2 x8@5Gbps/lane;
3. PCIe Bidirectional DMA Transfer Bandwidth: 3.2 GByte/s;
FMC Interface Specifications:
1. Standard FMC (HPC) interface, compliant with VITA57.1 specification;
2. Supports x8 GTX@10Gbps/lane high-speed serial bus;
3. Supports 80 pairs of LVDS signals;
4. Supports IIC bus interface;
5. +3.3V/+12V/+VADJ power supply, power consumption ≥15W;
6. Independent VIO_B_M2C power supply (can be provided by daughter card)
Dynamic Storage Performance:
1. Storage Bandwidth: 64-bit, DDR3 SDRAM, 500MHz operating clock;
2. Storage Capacity: Maximum support for 4 GByte DDR3 SDRAM;
Other Interface Performance:
1. 1 high-precision clock unit, supports 1 external clock input, 2 synchronous clock outputs;
2. 2 RS485 interfaces, 4 LVTTL inputs, 4 LVTTL outputs;
3. Onboard 1 FRAM memory, 1 BPI Flash;
Physical and Electrical Characteristics
1. Board Dimensions: 100 x 160mm
2. Board Power Supply: 1.5A max@+12V (±5%)
3. Cooling Method: Metal conduction cooling
Environmental Characteristics
1. Operating Temperature: -40°~﹢85°C;
2. Storage Temperature: -55°~﹢125°C;
3. Operating Humidity: 5%~95%, non-condensing

Software Support

Optional integrated Board Support Package (BSP);
1. FPGA low-level interface drivers;
2. Board-level interconnect interface drivers;
Customizable algorithms and system integration can be provided based on customer requirements:

Application Areas

Software-Defined Radio (SDR);
Radar and Baseband Signal Processing;
High-Speed Image and Graphics Processing;