Onboard FPGA Real-time Processor: JFMVU3P-2FFVC1517
Supports 1 FMC (HPC) Expansion Interface
Supports 2 QSFP+ Optical Fiber Interfaces
Supports x8 Gen3 PCIe Host Interface, System Bandwidth > 5 GByte/s
Supports 1 RJ45 Adaptive Gigabit Ethernet Port
Supports 1 GPIO/RS422 Interface

A fully localized high-performance data pre-processing platform based on Fudan Micro's 16nm process JFM9VU3P FPGA with a PCIe bus architecture. The board features one FMC+ (HPC) interface, one PCIe x8 host interface, one RJ45 Gigabit Ethernet port, and two QSFP+ 40G optical fiber interfaces. The board utilizes Fudan Micro's high-performance 9-series FPGA as a real-time processor to achieve functions such as FMC interface data acquisition, processing, and transmission. Its SerDes interfaces support speeds up to 28Gbps, enabling ultra-high-speed bus protocols like JESD204C and 100G Ethernet. Onboard are two independent sets of 64-bit DDR4 SDRAM large-capacity caches, providing a cache bandwidth of up to 38.4 GByte/s. By integrating different FMC daughter cards, this board can quickly establish server-based data acquisition, real-time processing, and high-performance storage platforms. It can be widely applied in scenarios such as radar and intermediate frequency signal acquisition, and video and image acquisition.

Technical Specifications

Onboard FPGA Real-time Processor: XC7K325T-2FFG900I;
Host Interface Specifications:
1. Complies with PXIe standard, supports PCI Express 2.0 specification;
2. Supports PCIe Gen2 x8 @ 5Gbps/lane;
3. PCIe Bidirectional DMA Transfer Bandwidth: 3.2 GByte/s;
Other Interface Specifications:
1. 1 SFP Optical Fiber Interface, supports 2.5G/3.125Gbps/lane speed;
2. 1 RJ45 Adaptive Gigabit Ethernet Port, can function as an EtherCAT master;
3. 1 RJ45 Fast Ethernet Port (100Mbps), can function as an EtherCAT slave;
4. 2 RS485 Interfaces, external connector is RJ11;
5. 1 SDI Video Input, 1 SDI Video Output (Optional Feature);
6. 1 DVI Display Output Interface;
Dynamic Storage Performance:
1. Storage Bandwidth: 64-bit, DDR3 SDRAM, 500MHz operating clock;
2. Storage Capacity: Maximum support for 4 GByte DDR3 SDRAM;
Other Interface Performance:
1. Onboard 8-channel Opto-isolated Digital I/O Interfaces;
2. Onboard 4-channel SATA Hard Drive Interfaces, for non-volatile storage;
3. Onboard 8-bit DIP Switch, 4 LED Indicators;
Physical and Electrical Characteristics
1. Board Dimensions: 106.65 x 167.65mm
2. Board Power Supply: 1.7A max @ +12V (±5%)
3. Cooling Method: Air Cooling
Environmental Characteristics
1. Operating Temperature: -40°C ~ +85°C;
2. Storage Temperature: -55°C ~ +125°C;
3. Operating Humidity: 5%~95%, non-condensing

Software Support

Optional Integrated Board Support Package (BSP);
1. FPGA Low-level Interface Drivers;
2. Board-level Interconnect Interface Drivers;
Customizable algorithms and system integration can be provided based on customer requirements:

Application Areas

Software Defined Radio (SDR);
Radar and Baseband Signal Processing;
Graphics and Image Processing Verification Platform;