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X86+FPGA+AI-Based Chip Defect Detection Solution

#人工智能#视觉检测

Application Scenarios

With the advancement of semiconductor technology, the demand for higher chip yield rates is increasing. However, the manufacturing process for integrated circuit chips is complex, and many defects often arise during their production. Therefore, defect detection is an essential process in integrated circuit manufacturing.

Customer Requirements

Compact size, low power consumption 2 x USB, 1 x LAN Fanless Core-i platform system Supports -10~60°C operating temperature Ensures 24/7 uninterrupted operation

Product Features

Onboard Intel® Celeron 4305UE CPU, with a maximum clock speed of 2.0GHz Supports single-channel DDR4 1866/2133MHz SO-DIMM memory slot, with a maximum memory capacity of 32GB Supports 3 Gigabit Ethernet ports Supports DP/HDMI extended synchronous/asynchronous display Built-in 1 x Mini-PCIe, 1 x M.2 2242, 1 x M.2 2230 for various module expansions 12V wide-voltage design, with lockable DC-IN connector

Product Specifications

系统 System

处理器 Processor

Intel® Celeron 4305UE CPU (2.0GHz)

内存 Memory

1 x DDR4 1866/2133MHz SO-DIMM up to 32 GB

图形 Graphics

Intel@UHD Graphics 610, dual display

存储 Storage

1 x mSATA 1 x M.2 2242 SSD

操作系统 OS

Windows 10, Linux

看门狗定时器 Watchdog Timer

Programmable 255 levels timer interval, from 1~255 sec/min

外部接口 External I/O

网口 Ethernet

1 x RJ45 Intel® I219-LM GbE (10/100/1000 Mbps) 2 x RJ45 Intel® I210AT (10/100/1000 Mbps)

显示 Video

1 x HDMI: max resolution up to 4096x2304@24Hz 1 x DP: max resolution up to 4096x2304@60Hz

音频 Audio

1 x Audio (Line-out&Mic-in 2 in 1) Realtek® ALC888S HD Audio codec (Coly 897)

串口 COM

2 x RS232/422/485 auto-flow

USB

4 x USB 3.1

GPIO

1 x 8 bit programmable GPIO(optional)

远程开关 Remote ON-OFF

1 x 2-pin remote terminal

内部接口 Internal I/O

扩展接口 Expansion

1 x Mini-PCIe slot(Support PCIe/SATA/USB2.0 Singal) 1 x M.2 2230 Key-E slot(Support WiFi/PCIe/USB2.0 signal ) 1 x M.2 2242 slot (Support PCIe/SATA signal)

SIM 卡 SIM Card

1 x SIM Card socket for 3G/4G module

环境 Environmental

操作温度 OperatingTemp.

-10℃ ~ 50℃(SSD), 0℃ ~ 40℃(HDD)

存储温度 Storage Temp.

-40℃ ~ 85℃

湿度Relative Humidity

5% ~ 95%, 非凝结状态Non-condensing

振动 Vibration

SSD: 5~500Hz, 2Grms operation HDD: 5~500Hz, 1Grms operation

机械冲击 Shock

Operation: 10G@11ms Non-operation: 30G@11ms

电源 Power

电源输入 Power Input

12V DC, 2-pin phoenix connector

机构Mechanical

外观 Housing

铝合金 Aluminum Alloy

安装方式 Mounting

Desk-Mount (Desktop) Wall-Mount (Wall-mounted) VESA-Mount (75 x 75 / 100 x 100 mm)(optional)

尺寸 Dimension

165 x 125 x 45 mm

重量 Weight

0.9kg

认证 Certification

安规认证 Safety Certification

CCC