Product Introduction
1. Product Overview

This is a dual-Xeon VPX module designed based on Intel Xeon Gold series processors. It utilizes high-speed connectors compliant with the VPX specification and is specifically engineered for high-performance, fully ruggedized servers. It features 128GB of soldered DDR4 memory and offers a rich set of high-strength I/O interfaces (6x SATA 3.0 / USB 3.0 / Gigabit Ethernet electrical ports / VGA interface / RS232 interface). This motherboard is characterized by high reliability, full ruggedization, high performance, and abundant interfaces, making it suitable as the core motherboard for high-reliability, fully ruggedized hyper-converged computing servers.

The motherboard dimensions are 233.35mm (width) * 270mm (length), with a board thickness of ≤2.4mm.

1. Product Photos

Key Features and Performance
CPU: ≥2 processors, X86 architecture, single CPU base frequency ≥2.2GHz, core count ≥8;
CPU performance is not inferior to Intel(R) Xeon(R) Gold 5120T;
Memory: ≥128GB, using soldered memory, memory type no less than DDR4;
System Drive: System drive socket reserved on the back of the PCB;

RAID: Onboard RAID management chip for hardware RAID functionality, supporting RAID levels: 0, 1, 5,

10, supporting at least 6 external hard drives (2TB single capacity);
System: Operating system installed on the RAID array;
VPX Interface Signals: ≥5 Gigabit service network ports (1000BASE-T), ≥1 VGA video interface, ≥3 USB interfaces (USB2.0), ≥1 Gigabit management network port (1000BASE-T), ≥1 RS232 data serial port; Gigabit network cards are soldered onboard;
Motherboard Front Panel Signals: Provides 1 standard VGA interface, 2 standard USB interfaces (USB3.0), 1 BMC and CPU debug serial port socket, 3 indicator lights (including power indicator, alarm indicator, and run indicator; alarm indicator is red, others are green), and a reset button;
Onboard BMC heartbeat LED (green) and CPLD heartbeat LED (green) are designed and placed on the front of the PCB for easy debugging and observation;
Graphics Card: AST2500 designed as a daughter card, using a Samtec seam8-20-s02.0-l-06-2-k connector, with interface definition compatible with AST2400 daughter card interface definition; graphics card interface signal definition in Appendix 3; maximum display resolution of the graphics card is not less than 1920*1200@60Hz;
Power Consumption: ≤260W;
2-way VGA display in duplicate mode;
USB interfaces feature power overcurrent protection;
VGA, RS232, network, and USB interfaces all have ESD protection and support hot-swapping;
AST2500 daughter card is used as the BMC management controller;
Supports motherboard hot-swapping;
External hard drives support hot-swapping;
Capable of KVM interconnection, providing human-machine interaction for operating and managing the server via KVM;
Features health diagnostic and detection functions: Capable of reporting relevant status information via Simple Network Management Protocol (SNMP) or from the network port, can periodically send self-test information, reporting server operating status, including but not limited to: power on/off status, availability status, core parameter information, etc.;
Chassis ground and digital ground are isolated.
Detailed Specifications and Parameters
1. Operating Environment

Specification Name

Specification Description

Remarks

Operating Temperature

-20℃ ~ +55℃

Storage Temperature

-40 ~ +70℃

Relative Humidity

95%

Vibration

2-100Hz, 1.5G/rms (operating state);

20-2000Hz, 2G/rms (non-operating state);

Shock

20G, 11ms (operating state);

30G, 11ms (non-operating state);

1. Electrical Specifications

Specification Name

Specification Description

Remarks

Operating Voltage

12V/5V standard ATX power supply,

Supports ATX/AT power-on modes

Typical Power Consumption

280W

Dual CPU + 64GB memory

Cooling Method

Air cooling

1. Mechanical Specifications

Specification Name

Specification Description

Remarks

Product Form Factor

VPX

Motherboard Dimensions

233.35mm x 270mm x 2.4mm

1. System Configuration

Specification Name

Specification Description

Remarks

Processor

The CPU unit uses an FCLGA3647 socket and can accommodate Intel Xeon GOLD series processors. The proposed processor is the Intel Xeon Gold 5120T, with core codename Skylake-SP, manufactured using a 14nm process, featuring 14 cores, 28 threads, a base frequency of 2.2GHz, a dynamic boost frequency of 3.2GHz, an L3 cache size of 19.25MB, and a Thermal Design Power (TDP) of 105W.

Chipset

Intel EY82C621, FCBGA1310 package

Memory

Each processor has 64GB of soldered 4-channel DDR4 memory chips onboard.

Storage

Onboard 1-channel M.2 NVMe SSD interface

RAID Controller

Features 6 SATA 3.0 interfaces supporting RAID 0, 1, 5, 10

Graphics Card

AST2500 chip,

Outputs VGA signal

Maximum support 1920x1080p@60Hz

Operating System

Galaxy Kylin Operating System

1. External Interfaces

Specification Name

Specification Description

Remarks

Rear Panel Interfaces

1x RS232 interface

1x VGA interface

3x USB 3.0 interfaces

5x Gigabit Ethernet interfaces

1x Remote Management Gigabit Ethernet port

Front Panel Interfaces

2x USB 3.0 interfaces

1x Power On button

1x Reset button

Reserved pins for convenient connection to the front panel

The following are onboard interfaces

SATA

Onboard 6x SATA 3.0 hard drive interfaces

1x mSATA interface

Hard drive interface supports

Hardware RAID 0/1/5/10

Network

Onboard 5x Gigabit Ethernet pin header interfaces

Can be used for ruggedized interfaces

Serial Port

Onboard 1x RS232 pin header interface

Can be used for ruggedized interfaces

Fan Interfaces

6x 4-pin intelligent fan management interfaces

2 CPUs occupy 2 interfaces

IPMB Interface

2x IPMB interfaces

Outputs voltage, current, temperature, and other information for core components, and supports board-level management.