A fully domestic intelligent heterogeneous computing platform development kit based on Fudan Microelectronics Qinglong 100TAI from Shanghai Fudan Microelectronics. This kit includes one Fudan Microelectronics Qinglong 100TAI core board and one PCIe-spec expansion baseboard.

The core board of this kit integrates the minimum system for 100TAI, featuring a single JFMQL100TAI900 System-on-Chip (SoC). This single chip integrates a quad-core Processing System (PS) and FMSH Programmable Logic (PL). The chip integrates three major modules: a high-performance SoC, a large-capacity FPGA, and an AI acceleration engine. It adopts a new generation multi-core bus architecture, supporting a more powerful quad-core SoC system, extensive FPGA resources, and an AI acceleration engine with a buyi architecture. It can support up to 27.5 TOPS of computing power, with support for VPE, INT8/INT16.

On the core board, the PS side features one group of 32-bit DDR3 SDRAM. Onboard are one 256Mbit QSPI Flash, one 32GByte eMMC storage, and one Ethernet PHY chip. The PL side features one group of 64-bit DDR3 SDRAM. Other I/O and GTX high-speed buses on the core board are routed out via FMC connectors.

The baseboard is in a standard half-height PCIe add-in card form factor. It accommodates one core board and expands to two RJ45 Gigabit Ethernet interfaces, four SFP+ optical fiber interfaces, one HDMI display interface, two UART serial ports, and one FMC interface.

This kit allows for rapid setup of an intelligent heterogeneous computing platform, providing convenience for users' high-performance and low-cost applications.

Technical Specifications

Onboard Fudan Microelectronics FPGA Programmable Fusion Chip:

FPGA Model: Fudan Microelectronics JFMQL100TAI900;
Processing System (PS): Quad-core processor, max frequency 1GHz;
Programmable Logic (PL) Resources: 444K Logic Cells, 26.5Mb Block RAM;
Programmable Logic (PL) Resources: 16 GTX transceivers, 2020 DSP slices;
AI Acceleration Engine: Computing power 27.52 TOPS@INT8, 6.88 TOPS@INT16;
AI Acceleration Engine: On-chip storage 2MB, array size 4x4, supports pruning;
AI Acceleration Engine: Data types supported INT8 and INT16;

Core Module Main Resources:

PS-side Memory: 1 group DDR3 SDRAM, 32-bit, 1GByte capacity;
PS-side FLASH Storage Resources: 1 eMMC (32GByte), 1 SPI Flash (256Mbit capacity), 1 SD card;
PS-side Network: 2-channel 1000BASE-T adaptive Gigabit Ethernet;
PL-side Memory: 1 group DDR3 SDRAM, 64-bit, 2GByte capacity;

Baseboard Main External Interface Functions:

Supports 1 FMC expansion interface: 8 GTX + 80 pairs LVDS;
Supports 1 PCIe x4 host interface;
Supports 4 SFP+ optical fiber interfaces;
Supports 2 PS-side Gigabit Ethernet interfaces, RJ45 interfaces on the baseboard;
Supports 1 PS-side serial port, 1 PL-side serial port;
Supports 1 CAN interface, 1 IIC interface;
Supports 1 HDMI video display output interface;

Physical and Electrical Characteristics

Board Dimensions: 222 x 250mm
Board Power Supply: 3A max@+12V (±5%)
Cooling Method: Natural air cooling

Environmental Characteristics

Operating Temperature: -40°~+85°C; Storage Temperature: -55°~+125°C;
Operating Humidity: 5%~95%, non-condensing

Software Support

Provides integrated Board Support Package (BSP);
Provides software development technical support;

Application Scope

Industrial control, machine learning, big data processing applications;

The FMQL100TAI core board is based on Fudan Microelectronics' PSOC architecture processor, model FMQL100TAI9000. The board is 100% designed with domestic chips. The board quality grades are divided into Domestic Grade I and Domestic Grade J. It possesses powerful computing capabilities, suitable for high-speed real-time signal processing fields such as radar, communication, image processing, and electronic countermeasures.

Technical Features (1) 1 Fudan Microelectronics high-performance PSOC processor;

(2) PSOC PL external 2GB DDR3 SDRAM memory; (3) PSOC PS external 1GB DDR3 SDRAM memory; (4) PSOC PS external 2 x 256Mbit SPI Flash