Title: Dual-Processor VPX High-Performance Xeon Server Module

Content:

Dual-Processor VPX High-Performance Xeon Server Module

1 Product Introduction

1.1 Product Overview

This is a dual-Xeon VPX module based on the Intel Xeon Gold series processors, featuring high-speed connectors compliant with the VPX specification. Designed for high-performance, fully ruggedized servers, it integrates 128GB of DDR4 memory using surface-mounted memory chips and provides a rich set of robust I/O interfaces (six channels of SATA 3.0/USB 3.0/Gigabit Ethernet/VGA/RS232). The motherboard features high reliability, full ruggedization, high performance, and abundant interfaces, making it ideal as the core motherboard for reliable, ruggedized hyper-converged computing servers.

The motherboard measures 233.35mm (width) × 270mm (length), with a board thickness ≤2.4mm.

1.2 Product Photograph

Figure 1: Product Photo

1.3 System Block Diagram

Figure 2: System Block Diagram

2 Key Features and Performance

CPU: ≥2 processors, x86 architecture, each with a clock frequency ≥2.2GHz and ≥8 cores;
CPU performance shall be no less than Intel(R) Xeon(R) Gold 5120T;
Memory: ≥128GB, using surface-mounted memory chips, DDR4 or higher;
System storage: Socket for system drive reserved on the back side of the PCB;
RAID: On-board RAID controller chip enabling hardware RAID with support for RAID levels 0, 1, 5, and 10; supports connection of at least six external drives (each up to 2TB capacity);
System: Operating system installed on RAID volume;
VPX interface signals: ≥5 Gigabit Ethernet ports (1000BASE-T), ≥1 VGA video port, ≥3 USB ports (USB 2.0), ≥1 Gigabit management Ethernet port (1000BASE-T), ≥1 RS232 serial data port; Gigabit NICs are surface-mounted;
Front panel signals: 1 VGA standard interface, 2 USB standard interfaces (USB 3.0), 1 BMC and CPU debug serial header, 3 indicator LEDs (power, alarm, and run; alarm LED is red, others are green), and a reset button;
On-board BMC heartbeat LED (green) and CPLD heartbeat LED (green), located on the top side of the PCB for easy debugging and observation;
Graphics: AST2500 implemented as a daughter card using a Samtec Seam8-20-S02.0-L-06-2-K connector, compatible with AST2400 daughter card pinout; signal definitions provided in Appendix 3; graphics resolution supports at least 1920×1200@60Hz;
Power consumption: ≤260W;
Dual VGA outputs operate in mirror mode;
USB ports include over-current protection;
VGA, RS232, Ethernet, and USB interfaces are all ESD-protected and support hot-swap;
AST2500 daughter card used as the BMC management controller;
Supports motherboard hot-swap;
External hard drives support hot-swap;
Capable of connecting to KVM, enabling human-machine interaction for server operation and management via KVM;
Health diagnostics: Capable of reporting status via Simple Network Management Protocol (SNMP) or through network ports; can periodically transmit self-check information to report server status including but not limited to power on/off status, availability, and core parameter data;
Chassis ground and digital ground are isolated.

3 Detailed Specifications and Parameters

3.1 Operating Environment

| Specification Name | Specification Description | Remarks | |------------------------|-------------------------------|-------------| | Operating Temperature | -20°C ~ +55°C | | | Storage Temperature | -40°C ~ +70°C | | | Relative Humidity | 95% | | | Vibration | 2–100Hz, 1.5G rms (operating);20–2000Hz, 2G rms (non-operating) | | | Shock | 20G, 11ms (operating);30G, 11ms (non-operating) | |

3.2 Electrical Specifications

| Specification Name | Specification Description | Remarks | |------------------------|-------------------------------|-------------| | Operating Voltage | 12V/5V standard ATX power supply,supports ATX/AT power-on modes | | | Typical Power Consumption | 280W | Dual CPU + 64GB memory | | Cooling Method | Air cooling | |

3.3 Mechanical Specifications

| Specification Name | Specification Description | Remarks | |------------------------|-------------------------------|-------------| | Form Factor | VPX | | | Motherboard Dimensions | 233.35mm × 270mm × 2.4mm | |

3.4 System Configuration

| Specification Name | Specification Description | Remarks | |------------------------|-------------------------------|-------------| | Processor | CPU uses FCLGA3647 socket, compatible with Intel Xeon Gold series processors; planned to use Intel Xeon Gold 5120T, codenamed Skylake-SP, 14nm process, 14 cores, 28 threads, base frequency 2.2GHz, turbo frequency up to 3.2GHz, 19.25MB L3 cache, TDP 105W | | | Chipset | Intel EY82C621, FCBGA1310 package | | | Memory | Each processor has 64GB of on-board, 4-channel DDR4 memory (surface-mounted) | | | Storage | 1 onboard M.2 NVMe SSD interface | | | RAID Controller | 6 SATA 3.0 ports supporting RAID 0, 1, 5, 10 | | | Graphics | AST2500 chip,outputs VGA signal,supports 1920×1080p@60Hz | | | Operating System | Kylin (Galaxy) operating system | |

3.5 External Interfaces

| Specification Name | Specification Description | Remarks | |------------------------|-------------------------------|-------------| | Rear Panel Interfaces | 1 RS232 interface1 VGA interface3 USB 3.0 interfaces5 Gigabit Ethernet interfaces1 remote management Gigabit Ethernet port | | | Front Panel Interfaces | 2 USB 3.0 interfaces1 Power On button1 Reset buttonPin headers reserved for easy front-panel connection | | | On-board Interfaces | | | | SATA | 6 onboard SATA 3.0 drive interfaces1 mSATA interface | Supports hardware RAID 0/1/5/10 | | Networking | 5 onboard Gigabit Ethernet pin headers | Usable for ruggedized interfaces | | Serial | 1 onboard RS232 pin header | Usable for ruggedized interfaces | | Fan Connectors | 6× 4-pin intelligent fan management headers (2 used by CPUs) | | | IPMB Interfaces | 2 IPMB interfaces | Output voltage, current, temperature of key components; support board-level management |