The XM745D is a fully domestically produced ARM core board based on Shanghai Fudan Microelectronics FMQL45T900. This core board integrates the minimum system of Fudan Micro's FMQL45T900 (compatible with XILINX's XC7Z045-2FFG900I) onto an 87*117mm core board. It can serve as a core module for functional expansion, enabling rapid construction of a signal processing platform, which facilitates user product development. The core board features DDR3 SDRAM, EMMC, SPI FLASH, Ethernet PHY chips, and other components. IO expansion for the PL (Programmable Logic) side is achieved through two board-to-board FMC connectors. The FMQL45T900 is a fully programmable fusion chip developed by Fudan Microelectronics. It integrates a Processing System (PS) based on a feature-rich quad-core processor and Programmable Logic (PL) on a single chip, utilizing the most advanced 28nm process technology. Coupled with corresponding development software, it enables an integrated hardware and software platform, facilitating user development, shortening development cycles, and reducing production costs.

Software Support  Integrated Board Support Package (BSP):  Supports PS-side development technical support;  Supports PL-side extended applications and support;  Customizable algorithms and system integration can be provided according to customer requirements. Application Scope  Industrial control signal processing;  Intelligent signal processing; Technical Specifications  Onboard Fudan Micro FPGA Programmable Fusion Chip:  FPGA Model: Fudan Micro FMQL45T900;  System on Chip (PS): Quad-core processor, maximum clock frequency 1GHz;  Logic Resources (PL): 350K Logic Cells, 19.2Mb Block RAM;  Logic Resources (PL): 16 GTX transceivers, 900 DSP slices;  Module's Main Storage and Interface Resources:  PS-side Memory: 1 group DDR3 SDRAM, 32-bit, 1GByte capacity;  PS-side Other Storage Resources: 1 EMMC (8GByte), 1 SPI Flash (256Mbit capacity);  PS-side Network: 1-channel 1000BASE-T adaptive Gigabit Ethernet;  PS-side Clock: 1 x 33.333MHz crystal oscillator, system clock;  PL-side Memory: 1 group DDR3 SDRAM, 64-bit, 2GByte capacity;  PL-side Clock: 1 x 50MHz crystal oscillator, logic clock;  Board supports watchdog reset;  Interconnect Interfaces:  Interface Connectors: 2 FMC connectors;  FMC1: 8 GTX transceivers, 17 pairs LVDS, 28 PS MIO;  FMC2: 8 GTX transceivers, 80 pairs LVDS;  Physical and Electrical Characteristics  Board Dimensions: 87 x 117mm  Board Power Supply: 2A max@+12V (±5%)  Cooling Method: Natural air cooling  Environmental Characteristics  Operating Temperature: -40°~﹢85°C;  Storage Temperature: -55°~﹢125°C;  Operating Humidity: 5%~95%, non-condensing