Board Overview
The PCIE-XM711 is a high-performance data preprocessing FMC carrier board based on the PCI Express bus architecture. It features Fudan Micro's JFM7K325T FPGA as the real-time processor to enable interconnection between various interfaces. This board supports 100% domestic production.

The board provides one FMC (HPC) interface, one PCIe x8 host interface, and onboard 64-bit DDR3 SDRAM for large-capacity buffering. It also supports one 1000BASE-T Gigabit Ethernet interface and four RS422 interfaces, along with GPIO input and output capabilities. By integrating different FMC daughter cards, this board enables rapid development of server-based hardware platforms for data acquisition, real-time processing, and high-performance storage.

The board conforms to the standard full-height PCI Express form factor, making it compatible with mainstream servers and workstations. It is widely applicable to server-based data acquisition, graphics and image processing, and video/image transmission applications.

Software Support

FPGA low-level interface and driver software:
- FPGA DDR3 SDRAM low-level driver;
- FPGA PCIe DMA interface test demo (including driver and host software);
Custom algorithm development and system integration available upon request.

Applications

Radar and intermediate frequency signal processing;
Software-defined radio (SDR) prototyping platform;
Graphics and image processing validation platform;

Technical Specifications

Onboard FPGA real-time processor: Fudan Micro JFM7K325T;
PCIe interface performance:
- Interface standard: PCI Express Gen2 x8;
- DMA support: Supported;
- Data bandwidth: >2 GByte/s;
- Driver support: Compatible with Win7/10 64-bit and Linux operating systems;
FMC interface specifications:
- Interface standard: FMC (HPC), compliant with VITA57.1;
- High-speed serial bus: Supports x8 GTX @ 10 Gbps/lane;
- Parallel bus: Supports 80 pairs of LVDS signals;
- Power supply to FMC: +12V / +VADJ, power delivery ≥15W;
- Daughter card power: Independent VIO_B_M2C supply;
Dynamic memory performance:
- Memory configuration: One 64-bit DDR3 SDRAM module;
- Memory bandwidth: 64-bit wide, operating clock at 500 MHz;
- Memory capacity: Up to 2 GByte DDR3 SDRAM (default 2 GB);
- Memory chip: Tsingmicro SCB13H4G160AF-11M;
Other interface specifications:
- 16 channels of +3.3V GPIO output;
- 8 channels of +3.3V GPIO input;
- 4 RS422 interfaces;
- 1 RJ45 Gigabit Ethernet interface;
- Onboard flash memory: 3 chips in total — 1 BPI NOR Flash for FPGA configuration, 1 Fudan Micro SPI NOR Flash, and 1 Zhongyi (GigaDevice) SPI NOR Flash;
Mechanical and Electrical Characteristics:
- Board dimensions: 106 x 207 mm;
- Power requirement: Max 3A @ +12V;
- Cooling method: Air cooling;
- Operating temperature: -40°C to +85°C