Board Overview

The XM714 is a domestically developed 5-channel HD-SDI video capture and image processing platform. This platform utilizes Shanghai Fudan Micro's high-performance Kintex series FPGA and Huawei HiSilicon's high-performance video processor HI3531DV200. Huawei HiSilicon's HI3531DV200 is a powerful neural network engine integrating an ARM A53 quad-core processor, supporting various intelligent algorithm applications. It integrates multiple MIPI video interfaces, breaking through the performance bottleneck of digital interface video input, and features a high-performance H.265 video codec engine, which further enhances the algorithmic effects and performance of traditional video image processing. The onboard powerful FPGA processor primarily handles video image pre-processing algorithms. It features an onboard 1GByte ultra-large capacity DDR3 SDRAM data cache, supporting a maximum memory bandwidth of 12GByte/s, breaking through the bottleneck of traditional video image processing bandwidth. The FPGA externally supports 5-channel SDI video image input and 1-channel LVDS video image output.

The physical diagram and functional block diagram are as follows:

Software Support  Integrated Linux operating system with desktop display:  Supports QT5.9.9;  Supports QWT6.1.3;  Supports databases, supports visualization and analysis platforms;  Provides video input display data stream test DEMO: Applications  Video encoding and decoding; image tracking, object recognition;  Intelligent image processing;

Technical Specifications  Processing Performance Specifications:  Fudan Micro FPGA: 1x JFM7K325T;  Huawei HiSilicon Processor: 1x HI3531DV200;  GigaDevice: 1x GD32F105 single-chip MCU;  Processor Peripheral Specifications:  FPGA Dynamic Cache: 1 group of 64-bit DDR3 SDRAM;  FPGA Non-Volatile Storage: 1x 1Gbit BPI Nor Flash;  FPGA Display Interface: 1-channel LVDS video display interface;  ARM Dynamic Cache: 1 group of 64-bit DDR4 SDRAM (8GByte capacity);  ARM Non-Volatile Storage: 1x 1T mSATA SSD, 1x 8G eMMC;  ARM Network Interface: 2-channel 1000BASE-T Gigabit Ethernet interfaces;  ARM Display Port: 1-channel HDMI output interface;  Video Interfaces:  Supports 5-channel SD/HD-SDI/3G-SDI video input;  Supports 1-channel HDMI video output (ARM side);  Supports 1-channel LVDS video output (FPGA side);  Image Processing Performance Specifications:  Supports 5-channel encoding, decoding, and compressed storage, with configurable bitrate from 2Mbps to 10Mbps;  SDI video input to HDMI (or LVDS) display latency ≤ 120ms;  Supports 3D denoising, dynamic enhancement; supports 5-channel simultaneous display and switching display;  Physical and Electrical Characteristics  Board Dimensions: 168 x 188mm  Board Power Supply: 2A max@+12V (±5%)  Cooling Method: Natural air cooling or metal conduction cooling  Environmental Characteristics  Operating Temperature: -40°C to +85°C;  Storage Temperature: -55°C to +125°C;  Operating Humidity: 5%~95%, non-condensing