Board Overview The VPX_XM630 is a high-speed signal processing platform based on the 6U VPX bus architecture. This platform utilizes a Xilinx Kintex UltraScale series FPGA (XCKU115) as the main processor to perform complex data acquisition, playback, and real-time signal processing algorithms. A high-performance embedded processor ZU9EG with an ARM core is employed as a co-processor to handle communication and management functions. The main processor XCKU115 on this platform is externally connected to two groups of 72-bit DDR4 SDRAM for ultra-large capacity data caching, with a data cache bandwidth of up to 2400MHz. The PL (Programmable Logic) side of the co-processor ZU9EG supports two groups of DDR4 SDRAM. The PS (Processing System) side of this co-processor is a powerful ARM processor, featuring one 64-bit quad-core ARM Cortex-A53 processor, one dual-core ARM Cortex-R5 real-time processor, and one ARM Mali™-400MP graphics processor. The PS side is externally connected to 72-bit DDR4 SDRAM, supporting ECC verification. To accommodate complex floating-point signal processing algorithms, the platform also supports a TI Keystone series multi-core DSP TMS320C6678, which can perform various data processing tasks with high real-time requirements. This board features excellent anti-vibration design, superior heat dissipation performance, and a unique environmental protection design, making it suitable for aerospace, aviation, marine, and other demanding application scenarios.

VPX_XM630 Physical Diagram

VPX_XM630 Block Diagram Software Support  Optional integrated board-level software development kit:  Customizable algorithms and system integration can be provided based on customer requirements: Applications  Software Defined Radio (SDR);  Radar and Baseband Signal Processing; Technical Specifications  Standard 6U VPX form factor, compliant with VITA 46 specification;  Onboard high-performance FPGA processor: XCKU115-2FFVF1924I  External connection to two groups of 72-bit DDR4 SDRAM;  External connection to two QSPI Flash chips for FPGA loading;  Onboard one high-performance MPSOC: XCZU9EG-2FFVB1156I  PL side connected to two groups of 32-bit DDR4 SDRAM;  PS side connected to one group of 72-bit DDR4 SDRAM;  PS side extends one 1000BASE-T Gigabit Ethernet port;  PS side connected to one RS232 serial port to the front panel J30J connector;  PS side supports SD/TF card boot;  PS side connected to one eMMC storage unit;  Onboard one high-performance DSP processor: TMS320C6678  External connection to one group of 64-bit DDR3 SDRAM;  External connection to one Nor Flash chip for DSP loading;  External connection to one 4Gbit Nand Flash for storing small amounts of parameter data;  External connection to one RJ45 Gigabit Ethernet interface;  FPGA and DSP interconnection: 1 lane SRIO x4@5Gbps/lane;  Physical and Electrical Characteristics  Board dimensions: 160 x 233mm  Board power supply: 6A max@+12V (±5%)  Cooling method: Conduction cooling via metal  Environmental Characteristics  Operating temperature: -40°C to +85°C, Storage temperature: -55°C to +125°C;