Board Overview

XM703 is a self-developed high-performance integrated video and image processing platform based on the PCIe bus architecture. This platform combines Xilinx's high-performance Kintex UltraScale series FPGA with Huawei HiSilicon's advanced video processor. The HiSilicon Hi3531DV200 integrates a powerful quad-core ARM A53 processor and a neural network engine, supporting various intelligent algorithm applications. It features multiple MIPI video interfaces, overcoming performance bottlenecks associated with digital interface video input, and includes a high-performance H.265 video codec engine that significantly enhances traditional video and image processing algorithms in both effect and performance.

The board integrates a powerful FPGA processor primarily responsible for video and image processing algorithms. It is equipped with 32 GByte of large-capacity DDR4 SDRAM data buffer, supporting up to 32 GByte/s memory bandwidth—breaking through traditional bandwidth limitations in video and image processing. The FPGA supports externally connected 8-channel SDI video input and 2-channel SDI video output.

XM703 Product Image

XM703 Schematic Diagram

Software Support

Optional integration of board-level software development kit (BSP);
FPGA low-level interface drivers;
PCIe bus interface development and driver support;
PCIe bus interface development and driver support;
Customized algorithm development and system integration available according to customer requirements;

Applications
(1) Video surveillance and security;
(2) In-vehicle DVR;
(3) High-definition video and image processing;
(4) Artificial Intelligence (AI);
(5) Face recognition;

Technical Specifications
I. On-board FPGA Real-Time Processor: XCKU060-2FFVA1517;
II. On-board HiSilicon Video Processor: HI3531DV200;
III. FPGA Interface Performance:
(1) Supports 2-channel QSFP+ 40G optical fiber interface;
(2) 1-channel 1000BASE-T Gigabit Ethernet port;
(3) On-board 32 GByte large-capacity cache unit;
(4) 2 sets of independent DDR4 SDRAM with data bandwidth no less than 32 GByte/s;
(5) 2 SPI Flash chips for FPGA configuration;

IV. ARM Interface Specifications:
(1) Supports 2-channel 1000BASE-T Gigabit Ethernet ports;
(2) Supports 1 USB 2.0 interface;
(3) Supports 1 USB 3.0 interface;
(4) Supports 1 mSATA solid-state storage;
(5) Supports 1 eMMC storage interface;
(6) Supports 1 HDMI display output interface;

V. Video Input/Output Interfaces:
(1) Supports 8-channel HD-SDI/3G-SDI video input;
(2) Supports 2-channel HD-SDI/3G-SDI video output;

VI. Video Encoding, Decoding, and Processing Performance:
(1) Supports 8-channel 1080P@30fps H.265/H.264 encoding and decoding;
(2) Maximum output bitrate up to 20 Mbps;
(3) Supports video scaling from 1/15x to 16x;
(4) Supports image scaling from 1/2x to 2x;
(5) Supports OSD overlay on 8 regions;
(6) Supports sharpening, 3D noise reduction, and dynamic contrast enhancement;

VII. Physical and Electrical Characteristics
(1) Board dimensions: 106 x 210 mm;
(2) Power supply: 5A max @ +12V (±5%);
(3) Cooling method: Air cooling with fan;