Why do Semiconductor and IC Test Equipment Need Upgrades? With the increasing demand for numerous new high-performance applications, Xinmai aims to provide better solutions for customers in the semiconductor and integrated circuit test equipment field. Semiconductor and integrated circuit (IC) test equipment is designed to simultaneously batch test hundreds of integrated circuit boards and chipsets on different lines within a single test machine, such as CPUs, SoCs, SSDs, and memory products.

To batch test integrated circuit products at a lower cost and more efficiently, IC test equipment tends to have an equal number of functional boards corresponding to each device under test (DUT), with these functional boards testing the integrated circuits via pre-loaded test programs. As test programs become increasingly complex, to shorten the average test cycle, core requirements for larger memory capacity and faster data transfer speeds must be met. Since a single integrated circuit tester contains hundreds of modules, to make the system smaller and more reliable, compact boards with optimized thermal solutions are preferred.

XM-SOM-6801 Specifications

| Product Type | COM Express Type 6 | |---|---| | Chipset | SOC | | CPU | Intel I3-4100M, 2.5GHz, Dual-core Processor Intel I5-4300M, 2.6GHz, Max Turbo Frequency 3.3GHz, Dual-core Processor Intel I7-4900M, 2.8GHz, Max Turbo Frequency 3.8GHz, Quad-core Processor | | Memory | Onboard 4G/8G optional DDR3 L memory; 1×memory slot, max support 8G | | BIOS | AMI | | Ethernet | 1×10M/100M/1000Mbps Intel I211 Ethernet | | Display | Supports VGA, DVI, HDMI, DP, LVDS display output; LVDS supports dual-channel 24bit, max resolution 1920×1080, supports synchronous/asynchronous dual display | | Audio | Integrated ALC662 high-fidelity audio controller, supports MIC, Line_out | | USB | 6×USB 2.0, 4×USB 3.0 | | Serial Port | 6×RS-232 | | Expansion | 1×PCIE*8, 1×PCIE*16 | | Storage | 4×SATA III hard drive interfaces | | Power Supply | DC 12V /ATX≤55W | | Watchdog | 255 levels, 1～255 seconds reset/reboot | | GPIO | 8-bit Input/Output | | Operating Temperature | -20~70℃, 10%~90% RH, non-condensing | | Storage Temperature | -40~85℃, 5%~95% RH, non-condensing | | Dimensions | 125mm ×95mm, Type 6 | | OS | Supports Win7, Win10, Linux and other operating systems |

Solution Xinmai's latest COM Express solutions (SOM-6883 and SOM-7583), equipped with 11th Gen Intel® Core™ processors, feature a compact design to help customers minimize system size as much as possible, allowing end-customers to focus solely on developing their unique applications. The SOM-6883 & SOM-7583 offer the following key features:

Core-i Computing Power: Compact form factor with powerful SoC
Integrated IBECC: Utilizes onboard memory for data correction to enhance system stability
Provides the fastest data transfer speed throughput:

PCIe Gen3/Gen4
SATA3
USB4/USB3.2 Gen2

Configurable TDP (cTDP) allows users to optimize system power consumption according to their needs; meanwhile, Advantech provides a slim fanless thermal module to minimize system size.
System can be expanded via COM carrier board

The SOM-7583 has a maximum TDP of 28W and is designed to deliver excellent performance in fanless thermal solutions. Integrated copper heat pipes enable efficient heat transfer, while an optimized fin spacing design creates maximum heat transfer area and airflow. The total height of the thermal module is less than 1U (4.4cm), making it ideal for customers to design their own system-level thermal solutions.

Equipped with PCIe Gen. 4, the SOM-6883 is suitable for applications requiring high data transfer speeds. Customers can leverage PCIe Gen.4 by adding an FPGA to the carrier board, allowing them to focus on developing their domain-specific functions while keeping their industrial technology confidential. The SOM-6883 features onboard memory and provides memory expansion via an additional SO-DIMM slot, thus offering more options for customer system designs.

Both the SOM-7583 and SOM-6883 adopt a wide-voltage input design and support wide-temperature operation from -40~85°C (-40~185°F). Furthermore, with an onboard NVMe SSD, we can help customers pre-install operating systems using licensed software packages.