Ultrasound System Requirements

Effective ultrasound systems accelerate diagnosis and help doctors make faster, more effective treatment decisions. To achieve this, ultrasound machines demand extremely high processing performance and graphics rendering capabilities to improve diagnostic accuracy and acquire precise images instantly. Similarly, they also need to be highly portable to adapt to evolving medical scenarios and trends, especially when treating patients with mobility issues or travel/activity restrictions due to COVID-19.

Challenges

High-end ultrasound systems typically leverage FPGAs, graphics cards, or AI accelerator modules to achieve high computational and graphics performance, leading to complex system designs and higher costs when integrating additional GPU or VPU engines. Furthermore, in pursuit of extreme performance, these systems inevitably encounter thermal dissipation issues. In normal applications, cooling solutions can address these problems. However, contemporary mainstream ultrasound equipment has limited space for cooling solutions and even requires quiet operation in hospital environments.

The combination of these constraints and requirements presents the following challenges:

Additional hardware/software integration costs lead to high development expenses.
Despite limited space, these solutions must be highly reliable to provide accurate and timely services for healthcare.
Ordinary thermal modules (too bulky for compact devices and too noisy for use in medical environments) are unsuitable for portable ultrasound solutions.

Excellent Performance with SOM-6883 and QFCS Technology

The XM-SOM-6883 features an 11th Gen Intel® Core™ processor (Tiger Lake-UP3) and Intel Iris® Xe (96 EU) graphics, delivering outstanding computational performance. Compared to previous generations, the SOM-6883 achieves a 3x graphics performance improvement and 2x AI model benchmark results without the need for an additional graphics card. Furthermore, QFCS (Quadra Flow Cooling System) technology features a thin and quiet design, capable of dissipating all TDP power and unleashing 100% of the CPU's performance.

This module not only offers groundbreaking performance but also supports onboard DDR4 memory, ultra-high-speed PCIe Gen4 (16GT/s), USB 4 Type-C interfaces, and other high-speed I/O, providing customers with thinner, shock-resistant characteristics for their system designs. In summary, the compact (95 x 95mm/3.74 x 3.74 in) SOM-6883 core module is an ideal solution for ultrasound equipment.

The powerful processor integrated into this compact embedded modular computer provides local computing/graphics performance and 8K SDR high-resolution display, thus meeting our customers' needs. Furthermore, the SOM-6883 enables AI-based diagnostics without the need for a second graphics card. These features simplify development, reduce costs, and shorten the time-to-market for ultrasound equipment.

Specifications of XM-SOM-6801

Product Type COM Express Type 6

Chipset SOC

CPU Intel i3-4100M, 2.5GHz, Dual-Core Processor Intel i5-4300M, 2.6GHz, Max Turbo Frequency 3.3GHz, Dual-Core Processor Intel i7-4900M, 2.8GHz, Max Turbo Frequency 3.8GHz, Quad-Core Processor

Memory Onboard 4G/8G optional DDR3L memory; 1×memory slot, max support 8G

BIOS AMI

Ethernet 1×10M/100M/1000Mbps Intel I211 Ethernet

Display Supports VGA, DVI, HDMI, DP, LVDS display outputs; LVDS supports dual-channel 24-bit, max resolution 1920×1080, supports synchronous/asynchronous dual display

Audio Integrated ALC662 high-fidelity audio controller, supports MIC, Line_out

USB 6×USB 2.0, 4×USB 3.0

Serial Ports 6×RS-232

Expansion 1×PCIe8, 1×PCIe16

Storage 4×SATA III HDD interfaces

Power Supply DC 12V /ATX≤55W

Watchdog 255 levels, 1～255 seconds reset/reboot

GPIO 8-bit Input/Output

Operating Temperature -20~70℃, 10%~90% RH, non-condensing

Storage Temperature -40~85℃, 5%~95% RH, non-condensing

Dimensions 125mm × 95mm, Type 6

OS Supports Win7, Win10, Linux and other operating systems

Key Features

[XM-SOM-6883] COM Express R 3.0 Type 6 Compact Module

Powered by a powerful 11th Gen Intel® Core™ 4-core processor with 28W low power consumption
Offers excellent graphics and AI performance via Intel® Iris® Xe Graphics G7 96 EU
Thin core module with robust design and onboard storage
Supports 4 independent 4K displays (up to two 8K)
Configurable USB 4 Type-C ultra-thin I/O and Thunderbolt interface
Supports ultra-high-speed I/O expansion: PCIe Gen4 (16GT/s), USB 3.2 Gen2 (10Gbps), 2.5GbE ultra-thin, silent QFCS thermal solution