The 8-inch aluminum metal etching semiconductor equipment DSP/ARM+FPGA motion controller supports customization.

The NMC508M 8-inch aluminum metal etcher is an inductively coupled high-density plasma dry etching system, primarily used for aluminum and tungsten metal etching processes on 200mm wafers. The NMC508M is a multi-chamber cluster tool—an automated etching system capable of serial or parallel process handling. The system mainly consists of a transfer module, metal etch process module, strip module, cooling station, remote AC power rack, and control rack. The metal etch process module performs the metal etching process, while the strip module removes residual photoresist and corrosive gases after metal etching. The cooling station lowers wafer temperature, the transfer module safely and precisely transports wafers to designated stations, the power rack supplies electrical power to the system, and the control rack coordinates and manages the operation of all modules. Through a unique chamber structure and temperature control design, the NMC508M aluminum metal etcher delivers excellent particle contamination control, easy maintenance, and significantly enhances equipment stability, repeatability, and process performance.

Applications

0.35–0.11µm integrated circuits

With the rapid rise of IoT applications, demand for advanced packaging has surged, becoming another driving force for China's semiconductor market expansion following the LED boom. Emerging packaging technologies focus on integration and wafer-level packaging (WLP). Copper Bumping technology reduces the original 100–200μm pitch to 50–100μm, making it a key enabler for advanced processes. As a critical step in the Bumping process, Descum processing holds significant market potential. Keeping pace with market trends, NAURA Microelectronics Equipment Co., Ltd. has leveraged years of technical expertise and experience in etching to develop the BMD P230 Descum system for Bumping production lines.