1 Evaluation Board Introduction

Based on the TI OMAP-L138 (fixed/floating-point DSP C674x + ARM9) + Xilinx Spartan-6 FPGA processor;
OMAP-L138 and FPGA are connected via uPP, EMIFA, and I2C buses, supporting communication speeds up to 228 MByte/s; OMAP-L138 runs at 456 MHz with computing performance up to 3648 MIPS and 2746 MFLOPS;
FPGA compatible with Xilinx Spartan-6 XC6SLX9/16/25/45, offering strong platform scalability;
The development board exposes abundant peripherals, including Gigabit Ethernet, SATA, EMIFA, uPP, USB 2.0, and other high-speed data interfaces, as well as common interfaces such as GPIO, I2C, RS232, PWM, and McBSP;
Passed high and low temperature testing, suitable for harsh operating environments;
DSP + ARM + FPGA tri-core SOM (System-on-Module), dimensions 66mm × 38.6mm, using industrial-grade B2B connectors to ensure signal integrity; Ø
Supports bare-metal, SYS/BIOS, and Linux operating systems.

Figure 1 Front and side views of the development board

The XM138F-IDK-V3.0 is a development board designed based on Shenzhen Xinming's XM138-SP6-SOM core module, using a 4-layer PCB with lead-free immersion gold process. It provides a test platform for the XM138-SP6-SOM core module, enabling rapid evaluation of its overall performance.

The XM138-SP6-SOM exposes all CPU resource signal pins, making secondary development extremely easy. Customers can focus on application-level development, significantly reducing development difficulty and time cost, accelerating time-to-market and enabling rapid capture of market opportunities. It provides not only abundant demo programs but also detailed development tutorials and comprehensive technical support to assist customers with carrier board design, debugging, and software development.

2 Typical Application Areas

Data acquisition, processing, and display systems
Intelligent power systems
Image processing equipment
High-precision instruments and meters
Mid-to-high-end CNC systems
Communication equipment
Audio and video data processing

Figure 2 Typical application areas

3 Hardware and Software Specifications

Block diagram of development board peripheral resources

Figure 3 Development board interface diagram

Figure 4 Development board interface diagram

Table 1 Hardware Resources

CPU

TI OMAP-L138, fixed/floating-point DSP C674x + ARM9, dual-core 456 MHz

Xilinx Spartan-6 XC6SLX9/16/25/45 FPGA

ROM

OMAP-L138 side: 128/256/512 MByte NAND FLASH

Spartan-6 side: 64 Mbit SPI FLASH

RAM

OMAP-L138 side: 128/256 MByte DDR2

B2B Connector

2 × 80-pin male B2B, 2 × 80-pin female B2B, 0.5 mm pitch, total 320 pins

2 × 25-pin IDC3 header, 2.54 mm pitch, for EMIFA expansion signals

2 × 25-pin IDC3 header, 2.54 mm pitch, for FPGA GPIO expansion signals

2 × 15-pin headers, 2.54 mm pitch, including I2C, McBSP, PWM, FPGA differential IO, and other expansion signals

LED

2 × power indicator LEDs (1 on baseboard, 1 on core board)

5 × programmable LEDs (3 on baseboard, 2 on core board)

5 × programmable LEDs (3 on baseboard, 2 on core board, FPGA side)

KEY

1 × system reset button

3 × programmable input buttons (including 1 non-maskable interrupt button)

5 × programmable LEDs (3 on baseboard, 2 on core board, FPGA side)

JTAG

1 × 14-pin TI Rev B JTAG interface, 2.54 mm pitch

1 × 14-pin FPGA JTAG interface, 2.00 mm pitch

LCD

1 × LCD touch screen interface

BOOT SET

1 × 5-bit DIP switch for boot mode selection

1 × Micro SD card interface

RTC

1 × RC1220 RTC socket, 3V

SATA

1 × 7-pin SATA hard drive interface

Ethernet

1 × RJ45 Ethernet port, 10/100M auto-negotiation

USB

1 × Micro USB 2.0 OTG interface

1 × USB 1.1 HOST interface

UART

2 × RS232 serial ports: UART2 via Micro USB, UART1 via DB9; 4-wire TTL header (TXD, RXD, 3V3, GND) also exposed

SWITCH

1 × power toggle switch

POWER

1 × 12V 2A DC input DC417 power jack, 4.4 mm outer diameter, 1.65 mm inner diameter

Table 2 Software Resources

ARM Side Software Support

Bare-metal, Linux operating systems (Linux-3.3, Linux-2.6.37, Linux-2.6.33)

DSP Side Software Support

Bare-metal, SYS/BIOS operating system

CCS Version

CCS 5.5

GUI Development Tools

Dual-Core Communication Components

SysLink, DSPLink

Software Development Kits Provided

MCSDK, DVSDK

ISE Version

ISE 14.7

Linux Driver Support

NAND FLASH, DDR2, SPI FLASH, I2C EEPROM, MMC/SD, SATA, USB 2.0 HOST, USB 2.0 OTG, LED, BUTTON, RS232, RS485, UART TL16C754C, CAN MCP2515, AUDIO TLV320AIC3106, Ethernet LAN8710 MII, Ethernet LAN8720 RMII, Ethernet LAN9221 EMIFA, 7-inch Touch Screen LCD, VGA CS7123, RTC, ADC AD7606, ADC AD7656, ADC ADS8568, DAC AD5724, CMOS Sensor OV2640, Video Decoder TVP5147, USB 3G ZTE MC2716, USB WIFI RTL8188, USB Mouse, USB Keyboard

4 Development Resources

(1) Provide core module pin definitions, editable baseboard schematics, editable baseboard PCB, chip datasheets—shortening hardware design cycle;

(2) Provide system flashing images, kernel driver source code, file system source code, and abundant demo programs;

(3) Provide complete platform development packages and getting-started tutorials—saving software integration time and enabling quick onboarding;

(4) Provide abundant getting-started tutorials and development examples, including OMAP-L138 and FPGA communication examples;

(5) Provide detailed DSP+ARM dual-core communication tutorials, effectively resolving dual-core development bottlenecks;

(6) Provide Qt-based GUI development tutorials.

Shenzhen Xinming provides extensive development materials, video tutorials, and Chinese datasheets, creating a new landscape for OMAP-L138 platform development and leading the learning wave for OMAP-L138 + Spartan-6 DSP+ARM+FPGA tri-core systems.

Selected development examples are detailed in Appendix A, including:

Bare-metal development examples based on ARM
Linux development examples based on ARM
Bare-metal development examples based on DSP
SYS/BIOS development examples based on DSP
SYSLINK-based dual-core development examples
DSPLINK-based dual-core development examples
XM_IPC-based dual-core development examples
PRU assembly development examples
FPGA-side development examples

5 Electrical Characteristics

Core Module Operating Environment

Table 3

Environmental Parameter

Minimum

Typical

Maximum

Commercial Temperature

0°C

70°C

Industrial Temperature

-40°C

85°C

Operating Voltage

3.3V

Power Consumption Test

Table 4

6 Mechanical Dimensions

Table 5

Core Module

Development Board

PCB Dimensions

66mm × 38.6mm

165mm × 110mm

Number of Mounting Holes

Figure 5 Core module mechanical dimensions

Figure 6 Evaluation board mechanical dimensions

7 Product Ordering Models

Table 6

Model

CPU Frequency

NAND FLASH

DDR2

SPI FLASH

FPGA Model

Temperature Grade

SOM-XM138F-4-4GN1GD2S16-I

456MHz

512MB

128MB

64Mbit

XC6SLX16

Industrial

SOM-XM138F-4-4GN2GD2S16-I

456MHz

512MB

256MB

64Mbit

XC6SLX16

Industrial

SOM-XM138F-4-4GN1GD2S45-I

456MHz

512MB

128MB

64Mbit

XC6SLX45

Industrial

SOM-XM138F-4-4GN2GD2S45-I

456MHz

512MB

256MB

64Mbit

XC6SLX45

Industrial

Note: Default configuration is SOM-XM138F-4-4GN1GD2S16-I. Contact sales personnel for other models.

8 Development Board Kit Contents

Table 7

Item

Quantity

XM138F-IDK-V3 Development Board (with core module)

1 unit

12V/2A Power Adapter

1 unit

Documentation CD

1 set

Micro SD System Card

1 unit

SD Card Reader

1 unit

Straight-through Ethernet Cable

1 piece

Micro USB Data Cable

1 piece

9 Technical Support

(1) Assist in carrier board design and testing to reduce hardware design errors;

(2) Assist in resolving anomalies encountered during operation per user manual;

(3) Assist in product fault diagnosis;

(4) Assist in correctly compiling and running provided source code;

(5) Assist in secondary product development;

(6) Provide long-term after-sales service.

10 Value-Added Services

Custom carrier board design
Custom core module design
Embedded software development
Joint project development
Technical training