Title: Multi-Core Heterogeneous Evaluation Board Solution Based on TI C6748 + Spartan-6

Content:

1 Introduction to the Evaluation Board

Based on TI TMS320C6748 fixed-point/floating-point DSP C674x + Xilinx Spartan-6 FPGA processor;
DSP and FPGA connected via uPP, EMIFA, and I2C buses, supporting communication speeds up to 228 MByte/s;
DSP clock speed of 456 MHz, delivering up to 3648 MIPS and 2746 MFLOPS computational performance;
FPGA compatible with Xilinx Spartan-6 XC6SLX9/16/25/45, offering strong platform scalability;
The development board exposes rich peripherals, including Gigabit Ethernet, SATA, EMIFA, uPP, USB 2.0, and other high-speed data transmission interfaces, as well as common interfaces such as GPIO, I2C, RS232, PWM, McBSP, VGA, PMOD, and RS485;
Passed high and low temperature testing, suitable for harsh operating environments;
DSP+FPGA dual-core SOM (System-on-Module), measuring 66mm × 38.6mm, using industrial-grade B2B connectors to ensure signal integrity;
Integrated charge/discharge battery circuit, multiple standard industrial interfaces, supports connection to multi-channel AD, DA, and other modules, offering strong expandability;
Supports bare-metal and SYS/BIOS operating systems.

Figure 1 Front and side views of the development board

The XM6748F-IDK-V3.0 is a development board designed based on the Shenzhen Xinming (Xinmai) XM6748F-SOM core module. It features a 4-layer PCB manufactured using lead-free immersion gold process, providing users with a test platform for the XM6748F-SOM core module to rapidly evaluate its overall performance.

The XM6748F-SOM exposes all CPU resource signal pins, making secondary development extremely easy. Customers can focus solely on application-level development, significantly reducing development difficulty and time cost, accelerating time-to-market and enabling early market penetration. In addition to providing abundant demo programs, detailed development tutorials and comprehensive technical support are also offered to assist customers with baseboard design, debugging, and software development.

2 Typical Application Areas

Data acquisition, processing, and display systems
Intelligent power systems
Image processing equipment
High-precision instruments and meters
Mid-to-high-end CNC systems
Communication equipment
Audio and video data processing

Figure 2 Typical application areas

3 Hardware and Software Specifications

Block diagram of development board peripheral resources

Figure 3 Development board interface diagram

Figure 4 Development board interface diagram

Table 1 Hardware Resources

CPU

TI TMS320C6748, fixed-point/floating-point DSP C674x, 456 MHz
Xilinx Spartan-6 XC6SLX9/16/25/45 FPGA

ROM

TMS320C6748 side: 128/256/512 MByte NAND FLASH
Spartan-6 side: 64 Mbit SPI FLASH

RAM

TMS320C6748 side: 128/256 MByte DDR2

B2B Connector

2×80-pin male B2B, 2×80-pin female B2B, 0.5 mm pitch, total 320 pins

2×25-pin IDC3 header, 2.54 mm pitch, EMIFA expansion signals
2×25-pin IDC3 header, 2.54 mm pitch, FPGA GPIO expansion signals
2×15-pin headers, 2.54 mm pitch, including I2C, McBSP, PWM, FPGA differential IO, and other expansion signals

LED

2× power indicator LEDs (1 on baseboard, 1 on core module)
5× programmable indicator LEDs (3 on baseboard, 2 on core module)
5× programmable indicator LEDs (3 on baseboard, 2 on core module, FPGA side)

KEY

1× system reset button
3× programmable input buttons (including 1 non-maskable interrupt button)
5× programmable indicator LEDs (3 on baseboard, 2 on core module, FPGA side)

JTAG

1× 14-pin TI Rev B JTAG interface, 2.54 mm pitch
1× 14-pin FPGA JTAG interface, 2.00 mm pitch

LCD

1× LCD touch screen interface

BOOT SET

1× 5-bit DIP switch for boot mode selection

1× Micro SD card interface

RTC

1× RC1220 RTC socket, 3V supply

SATA

1× 7-pin SATA hard drive interface

Ethernet

1× RJ45 Ethernet port, 10/100M auto-negotiation

USB

1× Micro USB 2.0 OTG interface
1× USB 1.1 HOST interface

UART

2× RS232 serial ports: UART2 via Micro USB, UART1 via DB9 connector; 4-wire TTL header (TXD, RXD, 3V3, GND) also exposed

SWITCH

1× power toggle switch

POWER

1× 12V 2A DC input via DC417 connector, 4.4 mm outer diameter, 1.65 mm inner diameter

Note: Shenzhen Xinmai XM138F-SOM, XM1808F-SOM, and XM6748F-SOM core modules are pin-to-pin compatible in hardware.

Table 2 Software Resources

DSP Software Support

Bare-metal, SYS/BIOS operating system

CCS Version

CCS 5.5

ISE Version

ISE 14.7

4 Development Resources

(1) Provide core module pin definitions, editable baseboard schematics, editable baseboard PCB, chip datasheets—shortening hardware design cycle;
(2) Provide system flashing images, kernel driver source code, file system source code, and abundant demo programs;
(3) Provide complete platform development packages and getting-started tutorials—saving software integration time and enabling fast onboarding;
(4) Provide rich getting-started tutorials and development examples, including OMAP-L138-to-FPGA communication examples;
(5) Provide detailed DSP+ARM dual-core communication tutorials, effectively solving dual-core development bottlenecks;
(6) Provide GUI development tutorials based on Qt.

Shenzhen Xinmai provides extensive development materials, video tutorials, and Chinese datasheets, creating a new landscape for OMAP-L138 platform development and leading the learning trend for the OMAP-L138 + Spartan-6 DSP+ARM+FPGA tri-core architecture.

Selected development examples are detailed in Appendix A, including:

Bare-metal development examples for ARM side
Linux development examples for ARM side
Bare-metal development examples for DSP side
SYS/BIOS development examples for DSP side
SYSLINK-based dual-core development examples
DSPLINK-based dual-core development examples
XM_IPC-based dual-core development examples
PRU assembly development examples
FPGA-side development examples

5 Electrical Characteristics

Core Module Operating Environment

Table 3

Environmental Parameter

Minimum

Typical

Maximum

Commercial temperature

0°C

70°C

Industrial temperature

-40°C

85°C

Operating voltage

3.3V

Power Consumption Test

Table 4

6 Mechanical Dimensions

Table 5

Core Module

Development Board

PCB Dimensions

66mm × 38.6mm

165mm × 110mm

Number of Mounting Holes

Figure 5 Mechanical Dimensions of the Core Module

7 Product Ordering Models

Table 6

Model

CPU Frequency

NAND FLASH

DDR2

SPI FLASH

FPGA Model

Temperature Grade

SOM-XM6748F-4-4GN1GD2S16-I

456 MHz

512 MB

128 MB

64 Mbit

XC6SLX16

Industrial

SOM-XM6748F-4-4GN2GD2S16-I

456 MHz

512 MB

256 MB

64 Mbit

XC6SLX16

Industrial

SOM-XM6748F-4-4GN1GD2S45-I

456 MHz

512 MB

128 MB

64 Mbit

XC6SLX45

Industrial

SOM-XM6748F-4-4GN2GD2S45-I

456 MHz

512 MB

256 MB

64 Mbit

XC6SLX45

Industrial

Note: Default configuration is SOM-XM6748F-4-4GN1GD2S16-I. Contact sales personnel for other models.

8 Development Board Kit Contents

Table 7

Item

Quantity

XM6748F-IDK-V3 Development Board (with core module)

1 pc

12V/2A Power Adapter

1 unit

Documentation CD

1 set

Micro SD System Card

1 pc

SD Card Reader

1 unit

Straight-through Ethernet Cable

1 piece

Micro USB Data Cable

1 piece

9 Technical Support

(1) Assist with baseboard design and testing to reduce hardware design errors;
(2) Assist in resolving abnormal issues arising from user manual operations;
(3) Assist in product fault diagnosis;
(4) Assist in correctly compiling and running provided source code;
(5) Assist with product secondary development;
(6) Provide long-term after-sales service.

10 Value-Added Services

Custom baseboard design
Custom core module design
Embedded software development
Joint project development
Technical training